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Event die-cutting technology
24. November 2025

Focus on innovations worldwide. Marbach at three International Trade Fairs in Fall 2025.

We were represented at three major trade fairs in October and November 2025. The focus was on innovative solutions for the packaging industry. At the events, we showcased new products and further developments that specifically improve performance in packaging production.

The first event was the FEFCO Technical Seminar, which took place in Rome from October 8 to 10. We were represented there at Booth B01. The event, as the central platform for the European corrugated board industry, offered the ideal conditions for presenting new technologies. During a spotlight session, we presented the new digital zone levelling system DZL|foil. This is a flexible solution for precise height compensation in corrugated board die-cutting processes. A customized foil with an exact height profile ensures a smooth production process. The trade fair was a complete success for us. The strong interest in the new DZL|foil and the direct exchange with trade visitors from across the industry, made participation particularly valuable.

Just a few days later, on October 16 and 17, the DieTechExpo in Prague followed.
The trade fair brought together companies from the diemaker and paper processing industries. The focus was on marbaject, our high-performance rubber, the MDSS storage system for the safe and efficient storage of cutting dies, the mplaten|cleaner-smart platen cleaning device for cleaning die-cutting machines, and the mcut|multi multifunctional device for versatile applications in tool preparation. At the mbench|pro workbench, visitors were able to experience repair processes live in the interactive DieTechArea. André Angermeir, General Sales Manager Die Supplies & Automation, explained in retrospect “We were very pleased to be part of the newly aligned DieTechExpo in Prague. The broader focus and the involvement of paper processing companies created real added value for exhibitors and visitors. The discussions were exciting and the technical presentations very inspiring.”

The trade fair season concluded with Prod&Pack, which took place in Lyon from November 18 to 20. The trade fair is considered the central platform for the packaging, processing, and production industry in France. We were represented at Booth 7-N12, where we presented solutions for efficient packaging production. The intensive exchange with trade visitors from the food, pharmaceutical, cosmetics, chemical, and mechanical engineering sectors helped to establish new contacts and gain valuable insights into market needs.

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