One step makes all the difference. Patented Marbach technology for processing honeycomb board on both sides.

We offer an efficient solution for processing particularly thick materials with the double-sided die-cutting technology for honeycomb board. By processing both the top and bottom sides simultaneously in a single operation, processing times are reduced, precision is increased, and production processes are simplified.

The high material thickness of honeycomb board places special demands on the die-cutting process. Previously, several steps were required: After die-cutting and embossing the top side, the material had to be manually turned over before the reverse side could be processed.

With Marbach’s patented technology, this additional step is eliminated. A two-part die system consisting of an upper and lower die enables simultaneous processing of both sides in a single die-cutting cycle. Embossing patterns can be arranged independently on both sides.

“What makes our technology special is that even exceptionally thick honeycomb board can be precisely processed in a single operation. This saves time, reduces manual intervention, and increases process reliability,” explains Michael Kiesel, die-cutting technology specialist at Marbach.

A key advantage lies in the reduced cutting rule height: Instead of cutting rules with heights of up to 150 mm, we use shorter, more stable cutting rules that are 100 mm high. This minimizes deformation, improves dimensional accuracy, and ensures clean, straight cut edges as well as improved stackability.

At the same time, the even distribution of force across the die reduces wear on the cutting rules. Since no additional anvil is required, operating costs are reduced and die life is extended. This technology thus combines high precision with economical and reliable processing of honeycomb board.