To ensure that in future Marbach customers with large-format machines will also benefit from the many advantages of digital zone levelling, Marbach now offers the DZL|plateXL.
Tolerances due to unevenness in the cutting platen are part of the everyday life of a packaging manufacturer, and are mostly caused by wear. As small as the differences in the platen may be, their significance for quality and processing speed is huge.
Ralf Nuyken, industry manager corrugated board at Marbach: "We have already very successfully established our DZL|plate digital zone levelling for cardboard machines on the market for several years. Now, with the DZL|plateXL, we have developed a solution with a two-part protection plate explicitly for large-format corrugated die-cutting machines."
The two-part protection plate of the DZL|plateXL is individually provided with a printed height profile and thus adapted to the respective conditions of the die-cutting machine. The DZL|plateXL thus permanently takes over the zone make-ready of the machine by compensating for height differences in the die-cutting platen area. This ensures optimum pressure conditions during die-cutting and significantly reduces make-ready times for each individual job.
More information about the DZL|plateXL is available at the Marbach Experience Hub: https://experience.marbach.com/en/blog-detail/digital-zone-levelling-makes-everything-run-smoothly
In July, we introduced our new high-performance rubber for corrugated board cutting-dies under the name marbaject. This new type of rubber is being increasingly used in the market and is very popular with our customers.
With its mcut|multi, Marbach Die Supplies has a multifunctional device in its portfolio that significantly simplifies tool preparation in packaging production. This is because the mcut|multi cuts rule materials quickly and without deformation. This allows tools in the cutting-die preparation to be optimally prepared for their production use.
We are looking forward to the upcoming K trade fair in Düsseldorf. It will take place from October 19 to 26, 2022. We there will present our latest innovations in hall 3 at stand C50.