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February 23, 2018

Thin Wall Packaging-Conference USA 2018. Marbach presents itself.

Marbach Werkzeugbau (Tool Manufacturing) will participate at the Thin Wall Packaging USA in Chicago. The conference for thin-wall packaging solutions will take place from 20th to 21st March 2018 in Chicago. It covers the main technologies such as thermoforming as well as injection, blow and compression molding. The concept of the Thin Wall Conference was established in Cologne, Germany, and has now, after great success in Europe, been introduced to the US and Asia as well. 

Hubert Kittelmann, Head of Sales at Marbach: “Marbach supports the industry event as a headline sponsor and will present papers on new technologies such as the match-metal tool concept MT|easy or the new packaging solutions such as the Marbach Turner. Both were the leading topics at the last Thin Wall Packaging event in Cologne, which has been a great success for us.“ The Thin Wall Packaging conferences always offer unique networking opportunities in the light weight plastic packaging industry. Here, the leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry come together to debate the latest developments and market trends.

Kittelmann continues: “We look forward to the upcoming event in the US. It is always interesting to see what ideas, approaches and questions emerge in the different regions.“

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